Slim-bezel flexible display device and manufacturing method thereof

ABSTRACT

A slim-bezel flexible display device and a manufacturing method thereof are disclosed. A through hole is formed in a first base plate of a lower substrate in an area adjacent to an edge thereof. A conductive connection body is mounted in the through hole. The conductive connection body is connected to a circuit layout layer and a flexible connection circuit that is connected to a drive circuit board so as to have the drive circuit board and the circuit layout layer connected. It is not necessary for the side of the lower substrate associated with the circuit layout layer to provide an additional connection zone for connection with the flexible connection circuit so that an effective display zone of a flexible display device can be enlarged and a bezel area can be reduced.

CROSS REFERENCE TO RELATED APPLICATIONS

This is a divisional application of co-pending patent application Ser.No. 14/761,311, filed on Jul. 16, 2015, which is a national stage of PCTApplication Number PCT/CN2015/081728, filed on Jun. 18, 2015, claimingforeign priority of Chinese Patent Application Number 201510239874.7,filed on May 12, 2015.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to the field of displaying technology, andin particular to a slim-bezel flexible display device and amanufacturing method thereof.

2. The Related Arts

Nowadays, with the rapid growth of the demands in respect of portablemobile devices and wearable display products, flexible display deviceshave continuously attracting the attention of the industry and havebecome one of the hottest trends of the future development of the fieldof displaying technology. Various techniques are available for flexibledisplays, including the traditional liquid crystal display technology,bistable liquid crystal display technology, organic light-emitting diode(OLED) display technology, electrophoretic display technology,electrochromism (EC) display technology, and electroluminescent (EL)display technology

Slim-bezel flexible display devices have various advantages, includingenlarged effective displaying area and aesthetics, and are one of thehot spots of research and development of the industry.

A conventional flexible display device is illustrated in FIG. 1 andcomprises an upper substrate 100, a lower substrate 200, sealing resin300 sealing and connecting between the upper substrate 100 and the lowersubstrate 200, and a drive circuit board 400 that is electricallyconnected by a flexible connection circuit 410 to the lower substrate200, wherein the lower substrate 200 comprises a first base plate 210and a circuit layout layer 230 formed on the first base plate 210. Theupper substrate 100 is arranged to face the surface of the lowersubstrate 200 on which the circuit layout layer 230 is formed. The drivecircuit board 400 is arranged adjacent to the surface of the first baseplate 210 that is distant from the circuit layout layer 230 and iselectrically connected via the flexible connection circuit 410 to thecircuit layout layer 230.

In the above-described flexible display device, in addition to thearrangement of an effective display zone, the side of the lowersubstrate 200 that is associated with the circuit layout layer 230necessarily and additionally comprises a connection zone for connectionwith the flexible connection circuit 410. Since the connection zone doesnot provide effective displaying and takes a certain width, an area of abezel of the flexible display device is increased. Further, since theflexible connection circuit 410 has an end that is connected with thecircuit layout layer 210 formed on an upper surface of the lowersubstrate 200 and an opposite end that is connected to a drive circuitboard 300 located on the side of the lower surface of the lowersubstrate 200, the flexible connection circuit 410 must be set around anedge of the lower substrate 200 and shows a U-shaped configuration.Since the flexible connection circuit 410 occupies a certain amount ofspace at the edge of the lower substrate 200, the bezel of the flexibledisplay device is further expanded, making it hard to achieve slim-bezeldisplaying.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a slim-bezel flexibledisplay device, which has a narrower bezel and may improve displayingquality.

An object of the present invention is also to provide a manufacturingmethod of a flexible display device, in which a conductive connectionbody is arranged in a lower substrate and the conductive connection bodyis connected to a circuit layout layer and a flexible connection circuitthat is connected to a drive circuit board so as to have the drivecircuit board and the circuit layout layer connected, making it notnecessary for the side of the lower substrate associated with thecircuit layout layer to provide an additional connection zone forconnection with the flexible connection circuit so that an effectivedisplay zone of a flexible display device can be enlarged to achieve aslim bezel and improve displaying quality.

To achieve the above objects, the present invention provides aslim-bezel flexible display device, which comprises an upper substrate,a lower substrate, enclosure resin sealing and connecting between theupper substrate and the lower substrate, and a drive circuit boardelectrically connected by a flexible connection circuit to the lowersubstrate;

the lower substrate comprising a first base plate, a conductiveconnection body arranged in the first base plate, and a circuit layoutlayer arranged on the first base plate;

the upper substrate being arranged to face a surface of the lowersubstrate on which the circuit layout layer is formed;

the first base plate comprising a through hole formed therein in an areaadjacent to an edge thereof, the conductive connection body beingreceived and mounted in the through hole, the circuit layout layer beingset in contact engagement with and in electrical connection with an endof the conductive connection body, the drive circuit board and theflexible connection circuit being both arranged at one side of the firstbase plate that is distant from the circuit layout layer, the flexibleconnection circuit having two ends respectively connected to the drivecircuit board and an end of the conductive connection body that isdistant from the circuit layout layer so as to achieve electricalconnection between the drive circuit board and the circuit layout layer.

The lower substrate further comprises a thin-film transistor arrangedbetween the first base plate and the circuit layout layer and an organiclight emitting diode arranged on the circuit layout layer.

The upper substrate has a size smaller than a size of the lowersubstrate and the lower substrate and the upper substrate are laminatedtogether in such a way that the conductive connection body is located inan area of the lower substrate that does not overlap the uppersubstrate.

The first base plate is a flexible substrate.

The conductive connection body comprises a material of metal and theenclosure resin is an ultraviolet curable resin.

The present invention also provides a manufacturing method of aslim-bezel flexible display device, which comprises the following steps:

(1) providing a glass substrate and forming a first base plate on theglass substrate;

(2) forming a through hole in an area of the first base plate that isadjacent to an edge;

(3) forming a conductive connection body in the through hole;

(4) forming a circuit layout layer on the first base plate and theconductive connection body in such a way that the circuit layout layeris in contact engagement with and is electrically connected to an end ofthe conductive connection body so as to form a lower substrate, whereinthe lower substrate comprises the first base plate, the conductiveconnection body arranged in the first base plate, and the circuit layoutlayer arranged on the first base plate;

(5) providing an upper substrate, the upper substrate being arranged toface and laminated to a surface of the lower substrate on which thecircuit layout layer is formed and applying enclosure resin for sealingand connection therebetween;

(6) removing the glass substrate from the first base plate to expose aside of the first base plate that is distant from the circuit layoutlayer and an end of the conductive connection body that is distant fromthe circuit layout layer; and

(7) providing a drive circuit board and a flexible connection circuit,arranging both the drive circuit board and the flexible connectioncircuit close to one side of the first base plate that is distant fromthe circuit layout layer, connecting two ends of the flexible connectioncircuit respectively to the drive circuit board and the end of theconductive connection body that is distant from the circuit layoutlayer, whereby since the conductive connection body is electricallyconnected to the circuit layout layer, electrical connection between thedrive circuit board and the circuit layout layer is achieved.

In step (3), a process of manufacturing the conductive connection bodycomprises: using physical vapor deposition to form a conductive film onthe first base plate and subjecting the conductive film topatternization through a photolithographic process to preserve a portionthereof that corresponds to the through hole thereby forming aconductive connection body in the through hole.

In step (4), before the formation of the circuit layout layer, athin-film transistor is formed on the first base plate and after theformation of the circuit layout layer, an organic light emitting diodeis formed on the circuit layout layer so that the lower substrate soformed further comprises the thin-film transistor between the first baseplate and the circuit layout layer and the organic light emitting diodeon the circuit layout layer.

The upper substrate has a size smaller than a size of the lowersubstrate and after the lower substrate and the upper substrate arelaminated together, the conductive connection body is located in an areaof the lower substrate that does not overlap and the upper substrate.

The first base plate is a flexible substrate and the first base plate isformed through coating; and the conductive connection body comprises amaterial of metal and the enclosure resin is ultraviolet curable resin.

The present invention further provides a manufacturing method of aslim-bezel flexible display device, which comprises the following steps:

(1) providing a glass substrate and forming a first base plate on theglass substrate;

(2) forming a through hole in an area of the first base plate that isadjacent to an edge;

(3) forming a conductive connection body in the through hole;

(4) forming a circuit layout layer on the first base plate and theconductive connection body in such a way that the circuit layout layeris in contact engagement with and is electrically connected to an end ofthe conductive connection body so as to form a lower substrate, whereinthe lower substrate comprises the first base plate, the conductiveconnection body arranged in the first base plate, and the circuit layoutlayer arranged on the first base plate;

(5) providing an upper substrate, the upper substrate being arranged toface and laminated to a surface of the lower substrate on which thecircuit layout layer is formed and applying enclosure resin for sealingand connection therebetween;

(6) removing the glass substrate from the first base plate to expose aside of the first base plate that is distant from the circuit layoutlayer and an end of the conductive connection body that is distant fromthe circuit layout layer;

(7) providing a drive circuit board and a flexible connection circuit,arranging both the drive circuit board and the flexible connectioncircuit close to one side of the first base plate that is distant fromthe circuit layout layer, connecting two ends of the flexible connectioncircuit respectively to the drive circuit board and the end of theconductive connection body that is distant from the circuit layoutlayer, whereby since the conductive connection body is electricallyconnected to the circuit layout layer, electrical connection between thedrive circuit board and the circuit layout layer is achieved;

wherein in step (3), a process of manufacturing the conductiveconnection body comprises: using physical vapor deposition to form aconductive film on the first base plate and subjecting the conductivefilm to patternization through a photolithographic process to preserve aportion thereof that corresponds to the through hole thereby forming aconductive connection body in the through hole;

wherein in step (4), before the formation of the circuit layout layer, athin-film transistor is formed on the first base plate and after theformation of the circuit layout layer, an organic light emitting diodeis formed on the circuit layout layer so that the lower substrate soformed further comprises the thin-film transistor between the first baseplate and the circuit layout layer and the organic light emitting diodeon the circuit layout layer;

wherein the upper substrate has a size smaller than a size of the lowersubstrate and after the lower substrate and the upper substrate arelaminated together, the conductive connection body is located in an areaof the lower substrate that does not overlap and the upper substrate;and

wherein the first base plate is a flexible substrate and the first baseplate is formed through coating; and the conductive connection bodycomprises a material of metal and the enclosure resin is ultravioletcurable resin.

The efficacy of the present invention is that the present inventionprovides a slim-bezel flexible display device and a manufacturing methodthereof, in which a through hole is formed in an area of a first baseplate of a lower substrate adjacent to an edge and a conductiveconnection body is mounted in the through hole, wherein the conductiveconnection body is connected to a circuit layout layer and a flexibleconnection circuit connected to a drive circuit board so as to have thedrive circuit board and the circuit layout layer connected to eachother. Compared to the prior art, the present invention provides anarrangement that makes it not necessary for the side of the lowersubstrate associated with the circuit layout layer to provide anadditional connection zone for connection with the flexible connectioncircuit so that an effective display zone of a flexible display devicecan be enlarged and a bezel area can be reduced. Further, the flexibleconnection circuit is completely arranged at one side of the lowersubstrate so that the flexible connection circuit curving around an edgeof the lower substrate required in the prior art can be preventedthereby eliminating the issue of a lateral side space of the lowersubstrate being undesirably occupied, allowing further reduction of thebezel area for achieving slim-bezel displaying.

For better understanding of the features and technical contents of thepresent invention, reference will be made to the following detaileddescription of the present invention and the attached drawings. However,the drawings are provided for the purposes of reference and illustrationand are not intended to impose limitations to the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The technical solution, as well as other beneficial advantages, of thepresent invention will be apparent from the following detaileddescription of an embodiment of the present invention, with reference tothe attached drawing.

In the drawing:

FIG. 1 is a schematic view showing the structure of a conventionalflexible display device;

FIG. 2 is a schematic view showing a slim-bezel flexible display deviceaccording to the present invention;

FIG. 3 is a flow chart illustrating a manufacturing method of aslim-bezel flexible display device according to the present invention;

FIG. 4 is a schematic view illustrating a first step of themanufacturing method of the slim-bezel flexible display device accordingto the present invention;

FIG. 5 is a schematic view illustrating a second step of themanufacturing method of the slim-bezel flexible display device accordingto the present invention;

FIG. 6 is a schematic view illustrating a third step of themanufacturing method of the slim-bezel flexible display device accordingto the present invention;

FIG. 7 is a schematic view illustrating a fourth step of themanufacturing method of the slim-bezel flexible display device accordingto the present invention;

FIG. 8 is a schematic view illustrating a fifth step of themanufacturing method of the slim-bezel flexible display device accordingto the present invention; and

FIG. 9 is a schematic view illustrating a sixth step of themanufacturing method of the slim-bezel flexible display device accordingto the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

To further expound the technical solution adopted in the presentinvention and the advantages thereof, a detailed description is given toa preferred embodiment of the present invention and the attacheddrawings.

Referring to FIG. 2, the present invention provides a slim-bezelflexible display device, which comprises an upper substrate 10, a lowersubstrate 20, enclosure resin 30 sealing and connecting between theupper substrate 10 and the lower substrate 20, and a drive circuit board40 that is electrically connected by a flexible connection circuit 41 tothe lower substrate 20.

Specifically, the lower substrate 20 comprises a first base plate 21, aconductive connection body 22 arranged in the first base plate 21, and acircuit layout layer 23 arranged on the first base plate 21.

Specifically, the upper substrate 10 is arranged to face the surface ofthe lower substrate 20 on which the circuit layout layer 23 is formed.

Specifically, the first base plate 21 comprises a through hole 211formed therein in an area adjacent to an edge thereof. The conductiveconnection body 22 is received and mounted in the through hole 211. Thecircuit layout layer 23 is set in contact engagement with and inelectrical connection with an end of the conductive connection body 22.The drive circuit board 40 and the flexible connection circuit 41 areboth arranged at one side of the first base plate 21 that is distantfrom the circuit layout layer 23. The flexible connection circuit 41 hastwo ends respectively connected to the drive circuit board 40 and an endof the conductive connection body 22 that is distant from the circuitlayout layer 23 so as to achieve electrical connection between the drivecircuit board 40 and the circuit layout layer 23.

Specifically, the lower substrate 20 comprises additionaldevices/components (not shown), including a thin-film transistor (TFT)arranged between the first base plate 21 and the circuit layout layer 23and an organic light emitting diode (OLED) arranged on the circuitlayout layer 23.

Specifically, the upper substrate 10 has a size smaller than a size ofthe lower substrate 20 and after the lower substrate 20 and the uppersubstrate 10 are laminated together, the conductive connection body 22is located in an area of the lower substrate 20 that does not overlapthe upper substrate 10.

Preferably, the first base plate 21 is a flexible substrate.

Specifically, the upper substrate 10 comprises a second base plate.Preferably, the second base plate is a flexible substrate. Specifically,the upper substrate 10 is a package lid and is hermetically connected tothe lower substrate 20 by the enclosure resin 30 so as to achievepackaging of the lower substrate 20.

Specifically, the conductive connection body 22 comprises a material ofmetal, such as molybdenum, aluminum, copper, and silver.

Preferably, the enclosure resin 30 is an ultraviolet (UV) curable resin.

The present invention provides a slim-bezel flexible display device,which comprises a lower substrate 20 that comprises a first base plate21 comprising a through hole 211 formed therein in an area adjacent toan edge and a conductive connection body 22 received and retained in thethrough hole 211, wherein the conductive connection body 22 isconnectable to a circuit layout layer 23 and a flexible connectioncircuit 41 that is connected to a drive circuit board 40 so as toconnect the drive circuit board 40 and the circuit layout layer 23 toeach other. Compared to the prior art, the present invention provides anarrangement that makes it not necessary for the side of the lowersubstrate 20 associated with the circuit layout layer 23 to provide anadditional connection zone for connection with the flexible connectioncircuit 41 so that an effective display zone of a flexible displaydevice can be enlarged and a bezel area can be reduced. Further, theflexible connection circuit 41 is completely arranged at one side of thelower substrate 20 so that the flexible connection circuit 410 curvingaround an edge of the lower substrate 200 required in the prior art canbe prevented thereby eliminating the issue of a lateral side space ofthe lower substrate 200 being undesirably occupied (see FIG. 1),allowing further reduction of the bezel area for achieving slim-bezeldisplaying.

Referring to FIG. 3, the present invention also provides a manufacturingmethod of a slim-bezel flexible display device, which comprises thefollowing steps:

Step 1: as shown in FIG. 4, providing a glass substrate 50 and forming afirst base plate 21 on the glass substrate 50.

Specifically, the first base plate 21 is a flexible substrate.Preferably, the first base plate 21 is formed through coating.

Step 2: as shown in FIG. 5, forming a through hole 211 in an area of thefirst base plate 21 that is adjacent to an edge.

Specifically, the through hole 211 is formed through a photolithographicprocess.

Step 3: as shown in FIG. 6, forming a conductive connection body 22 inthe through hole 211.

Specifically, a process of manufacturing the conductive connection body22 is as follows: Physical vapor deposition (PVD) is used to form aconductive film on the first base plate 21 and the conductive film issubjected to patternization through a photolithographic process topreserve a portion thereof that corresponds to the through hole 211thereby forming a conductive connection body 22 in the through hole 211.

Specifically, the photolithographic process comprises operations ofcoating photoresist, exposure, development, wet etching, and removal ofphotoresist.

Preferably, the conductive connection body 22 comprises a material ofmetal, such as molybdenum, aluminum, copper, and silver.

Step 4: as shown in FIG. 7, forming a circuit layout layer 23 on thefirst base plate 21 and the conductive connection body 22 in such a waythat the circuit layout layer 23 is in contact engagement with and iselectrically connected to an end of the conductive connection body 22 soas to form a lower substrate 20, wherein the lower substrate 20comprises the first base plate 21, the conductive connection body 22arranged in the first base plate 21, and the circuit layout layer 23arranged on the first base plate 21.

Specifically, before the formation of the circuit layout layer 23,devices/components (not shown), including a thin-film transistor (TFT),can be formed on the first base plate 21 and after the formation of thecircuit layout layer 23, device/components (not shown), including anorganic light emitting diode (OLED), can be formed on the circuit layoutlayer 23. Thus, the lower substrate 20 so formed may further comprisesadditional devices/components, such as a TFT arranged between the firstbase plate 21 and the circuit layout layer 23 and an OLED arranged onthe circuit layout layer 23.

Step 5: as shown in FIG. 8, providing an upper substrate 10, the uppersubstrate 10 being arranged to face and laminated to a surface of thelower substrate 20 on which the circuit layout layer 23 is formed andapplying enclosure resin 30 for sealing and connection therebetween.

Specifically, the upper substrate 10 is a package lid and ishermetically connected to the lower substrate 20 by the enclosure resin30 so as to achieve packaging of the lower substrate 20.

Specifically, the upper substrate 10 comprises a second base plate.Preferably, the second base plate is a flexible substrate.

The upper substrate 10 has a size smaller than a size of the lowersubstrate 20 and after the lower substrate 20 and the upper substrate 10are laminated together, the conductive connection body 22 is located inan area of the lower substrate 20 that does not overlap the uppersubstrate 10.

Preferably, the enclosure resin 30 is an ultraviolet (UV) curable resin.

Step 6: as shown in FIG. 9, removing the glass substrate 20 from thefirst base plate 21 to expose a side of the first base plate 21 that isdistant from the circuit layout layer 23 and an end of the conductiveconnection body 22 that is distant from the circuit layout layer 23.

Step 7: providing a drive circuit board 40 and a flexible connectioncircuit 41, arranging both the drive circuit board 40 and the flexibleconnection circuit 41 close to one side of the first base plate 21 thatis distant from the circuit layout layer 23, connecting two ends of theflexible connection circuit 41 respectively to the drive circuit board40 and the end of the conductive connection body 22 that is distant fromthe circuit layout layer 23, whereby since the conductive connectionbody 22 is electrically connected to the circuit layout layer 23,electrical connection between the drive circuit board 40 and the circuitlayout layer 23 is achieved, and a flexible display device as shown inFIG. 2 is formed.

The present invention provides a manufacturing method of a slim-bezelflexible display device, in which a through hole 211 is formed in anarea of a first base plate 21 of a lower substrate 20 adjacent to anedge and a conductive connection body 22 is mounted in the through hole211, wherein the conductive connection body 22 is connected to a circuitlayout layer 23 and a flexible connection circuit 41 connected to adrive circuit board 40, so as to have the drive circuit board 40 and thecircuit layout layer 23 connected to each other. Compared to the priorart, the present invention provides an arrangement that makes it notnecessary for the side of the lower substrate 20 associated with thecircuit layout layer 23 to provide an additional connection zone forconnection with the flexible connection circuit 41 so that an effectivedisplay zone of a flexible display device can be enlarged and a bezelarea can be reduced. Further, the flexible connection circuit 41 iscompletely arranged at one side of the lower substrate 20 so that theflexible connection circuit 410 curving around an edge of the lowersubstrate 200 required in the prior art can be prevented therebyeliminating the issue of a lateral side space of the lower substrate 200being undesirably occupied (see FIG. 1), allowing further reduction ofthe bezel area for achieving slim-bezel displaying.

Based on the description given above, those having ordinary skills ofthe art may easily contemplate various changes and modifications of thetechnical solution and technical ideas of the present invention and allthese changes and modifications are considered within the protectionscope of right for the present invention.

What is claimed is:
 1. A manufacturing method of a slim-bezel flexibledisplay device, comprising the following steps: (1) providing a glasssubstrate and forming a first base plate on the glass substrate; (2)forming a through hole in an area of the first base plate that isadjacent to an edge; (3) forming a conductive connection body in thethrough hole; (4) forming a circuit layout layer on the first base plateand the conductive connection body in such a way that the circuit layoutlayer is in contact engagement with and is electrically connected to anend of the conductive connection body so as to form a lower substrate,wherein the lower substrate comprises the first base plate, theconductive connection body arranged in the first base plate, and thecircuit layout layer arranged on the first base plate; (5) providing anupper substrate, the upper substrate being arranged to face andlaminated to a surface of the lower substrate on which the circuitlayout layer is formed and applying enclosure resin for sealing andconnection therebetween; (6) removing the glass substrate from the firstbase plate to expose a side of the first base plate that is distant fromthe circuit layout layer and an end of the conductive connection bodythat is distant from the circuit layout layer; and (7) providing a drivecircuit board and a flexible connection circuit, arranging both thedrive circuit board and the flexible connection circuit close to oneside of the first base plate that is distant from the circuit layoutlayer, connecting two ends of the flexible connection circuitrespectively to the drive circuit board and the end of the conductiveconnection body that is distant from the circuit layout layer, so as toestablish electrical connection between the drive circuit board and thecircuit layout layer that is electrically connected to the conductiveconnection body; wherein the first base plate comprises a flexiblesubstrate having top and bottom surfaces opposite to each other, thethrough hole being formed in the flexible substrate between the top andbottom surfaces and forming an opening in each of the top and bottomsurfaces, such that the conductive connection body is received in thethrough hole with the ends of the conductive connection body exposedthrough the openings in the top and bottom surfaces of the flexiblesubstrate to be respectively connected to the circuit layout layer andthe flexible connection circuit.
 2. The manufacturing method of theslim-bezel flexible display device as claimed in claim 1, wherein instep (3), a process of manufacturing the conductive connection bodycomprises: using physical vapor deposition to form a conductive film onthe first base plate and subjecting the conductive film topatternization through a photolithographic process to preserve a portionthereof that corresponds to the through hole thereby forming aconductive connection body in the through hole.
 3. The manufacturingmethod of the slim-bezel flexible display device as claimed in claim 1,wherein in step (4), before the formation of the circuit layout layer, athin-film transistor is formed on the first base plate and after theformation of the circuit layout layer, an organic light emitting diodeis formed on the circuit layout layer so that the lower substrate soformed further comprises the thin-film transistor between the first baseplate and the circuit layout layer and the organic light emitting diodeon the circuit layout layer.
 4. The manufacturing method of theslim-bezel flexible display device as claimed in claim 1, wherein theupper substrate has a size smaller than a size of the lower substrateand after the lower substrate and the upper substrate are laminatedtogether, the conductive connection body is located in an area of thelower substrate that does not overlap and the upper substrate.
 5. Themanufacturing method of the slim-bezel flexible display device asclaimed in claim 1, wherein the first base plate is formed throughcoating; and the conductive connection body comprises a material ofmetal and the enclosure resin is ultraviolet curable resin.
 6. Amanufacturing method of a slim-bezel flexible display device, comprisingthe following steps: (1) providing a glass substrate and forming a firstbase plate on the glass substrate; (2) forming a through hole in an areaof the first base plate that is adjacent to an edge; (3) forming aconductive connection body in the through hole; (4) forming a circuitlayout layer on the first base plate and the conductive connection bodyin such a way that the circuit layout layer is in contact engagementwith and is electrically connected to an end of the conductiveconnection body so as to form a lower substrate, wherein the lowersubstrate comprises the first base plate, the conductive connection bodyarranged in the first base plate, and the circuit layout layer arrangedon the first base plate; (5) providing an upper substrate, the uppersubstrate being arranged to face and laminated to a surface of the lowersubstrate on which the circuit layout layer is formed and applyingenclosure resin for sealing and connection therebetween; (6) removingthe glass substrate from the first base plate to expose a side of thefirst base plate that is distant from the circuit layout layer and anend of the conductive connection body that is distant from the circuitlayout layer; and (7) providing a drive circuit board and a flexibleconnection circuit, arranging both the drive circuit board and theflexible connection circuit close to one side of the first base platethat is distant from the circuit layout layer, connecting two ends ofthe flexible connection circuit respectively to the drive circuit boardand the end of the conductive connection body that is distant from thecircuit layout layer, whereby since the conductive connection body iselectrically connected to the circuit layout layer, electricalconnection between the drive circuit board and the circuit layout layeris achieved; wherein the first base plate comprises a flexible substratehaving top and bottom surfaces opposite to each other, the through holebeing formed in the flexible substrate between the top and bottomsurfaces and forming an opening in each of the top and bottom surfaces,such that the conductive connection body is received in the through holewith the ends of the conductive connection body exposed through theopenings in the top and bottom surfaces of the flexible substrate to berespectively connected to the circuit layout layer and the flexibleconnection circuit; wherein in step (3), a process of manufacturing theconductive connection body comprises: using physical vapor deposition toform a conductive film on the first base plate and subjecting theconductive film to patternization through a photolithographic process topreserve a portion thereof that corresponds to the through hole therebyforming a conductive connection body in the through hole; wherein instep (4), before the formation of the circuit layout layer, a thin-filmtransistor is formed on the first base plate and after the formation ofthe circuit layout layer, an organic light emitting diode is formed onthe circuit layout layer so that the lower substrate so formed furthercomprises the thin-film transistor between the first base plate and thecircuit layout layer and the organic light emitting diode on the circuitlayout layer; wherein the upper substrate has a size smaller than a sizeof the lower substrate and after the lower substrate and the uppersubstrate are laminated together, the conductive connection body islocated in an area of the lower substrate that does not overlap and theupper substrate; and wherein the first base plate is formed throughcoating; and the conductive connection body comprises a material ofmetal and the enclosure resin is ultraviolet curable resin.